The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2000

Filed:

Jan. 29, 1998
Applicant:
Inventor:

Hironobu Ikeda, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257676 ; 257692 ; 257693 ; 257696 ;
Abstract

A semiconductor device mount structure containing a semiconductor device (10), a connection substrate (30) disposed at the lower side of the semiconductor device (10), and leads (20) which are connected to external connection terminals (12) of the semiconductor device (10) at one ends thereof, turned back and connected to wires provided on the connection substrate (30) at the other ends thereof. The connection substrate (30) is constructed by plural carrier substrates. Each of the plural carrier substrates is right-angled isosceles triangular, and the plural carrier substrates are arranged so as to form a substantially square shape at the lower portion of the semiconductor device (10).


Find Patent Forward Citations

Loading…