The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2000
Filed:
May. 26, 1998
Masaru Ando, Kamakura, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
High power semiconductor module device constituted in such a manner that a circuit board to which semiconductor pellets are bonded is bonded onto a heat sink, and an electrically insulating case with elasticity which has a tubular portion surrounding the sides of the circuit board is mounted on the heat sink, wherein there is provided a push member which is composed of an electrically insulating material and pushes the respective pellet wholly or partially from above with a predetermined pressure. By thus pushing the pellet by means of the push member, the destruction of the module device due to the thermal fatigue of the bonded portions of the circuit board and the pellets, the bonded portion of the circuit board and heat sink, and the bonded portions of the bonding wires is prevented even when the temperature of the whole module is repeatedly raised and lowered by the repetition of heating and cooling during the operation of the pellets.