The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2000

Filed:

Dec. 04, 1997
Applicant:
Inventor:

Dangrong Ronald Liu, West Bloomfield, MI (US);

Assignee:

Ford Motor Company, Dearborn, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174260 ; 228254 ; 174 681 ;
Abstract

A printed circuit board 50 with reinforced solder joints and having a substrate 11 having mounting pads 14 arranged thereon and a surface mount component 13 having terminations 12, wherein the component 13 is disposed on the substrate 11 with each termination 12 being registered atop a respective mounting pad 14. A solder joint 10 connects each termination 12 with its respective mounting pad 14, and a thin metallic member 30 is disposed within each solder joint 10 between each termination 12 and its respective mounting pad 14. Metallic member 30 is space from both the mounting pad ant the termination and is the same size as the mounting pad or smaller.


Find Patent Forward Citations

Liu, Dangrong. (2000). Solder joints for printed circuit boards having intermediate metallic (U.S. Patent No. 6087596). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6087596

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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