The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2000

Filed:

Dec. 17, 1997
Applicant:
Inventor:

Shigeki Wada, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438666 ; 257 66 ; 257280 ; 257413 ; 257472 ; 438761 ;
Abstract

In a method for manufacturing a semiconductor device, an insulating layer is formed on a semiconductor substrate, and a refractory metal is formed layer on the insulating layer. Then, a first opening is perforated in the refractory metal layer, and a part of the insulating layer is etched by using the refractory metal as a mask. Then, a second opening is perforated in the refractory metal layer. The second opening is superposed onto the first opening and is larger than the first opening. Then, the insulating layer is again etched by using the refractory metal layer as a mask, so that a T-shaped opening is perforated in the insulating layer. Finally, a modified T-shaped gate metal electrode is formed on the insulating layer having the T-shaped opening.


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