The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2000
Filed:
Sep. 14, 1998
Applicant:
Inventors:
Shih-Ping Lee, Hsinchu, TW;
Kuo-Kang Liu, Hsinchu, TW;
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ; H05K / ;
U.S. Cl.
CPC ...
1562731 ; 1562742 ; 1562757 ; 29832 ; 257783 ;
Abstract
A novel method for bonding of micro elements with in-situ bonding means is disclosed. Suited bonding means include heating coils and bonding materials. The bonding means are provided in the elements to be bonded during their preparation. While the elements are bonded, electric power is applied to the heating coil such that the bonding material is melt and that the elements are bonded. An elastic calibration means is provided in at least one of the elements to be bonded such that the distance and parallelism of the elements may be calibrated during the bonding process.