Ball grid array package

Abstract

A ball grid array package (10) is provided that includes a heat spreader (14), a stiffener (13), a substrate (16), and a die or chip (12). The stiffener (13) is mounted to the heat spreader (14) and has a cavity formed therein. The stiffener (13) may serve as either a ground plane or a power plane of ball grid array package (10), depending on the desired implementation. The substrate (16) includes a signal plane (30) and a power bus (28) on a first surface and has a cavity formed therein. The substrate (16) is mounted to the stiffener (13) through a second surface. The substrate (16) further having at least one hole formed from the first surface to the second surface and a plurality of solder balls, similar to solder ball (20), to provide an external connection to the ball grid array package (10). Finally, the chip (12) is mounted to portion of the heat spreader (14) exposed through the cavity of the substrate (16) and the stiffener (13) and wire bonded to the various electrical planes, including the stiffener (13). The present invention also provides a method (100) for forming the ball grid array package (10) of the present invention.