Test socket

Abstract

A test socket for an integrated circuit package having an upper housing and a lower housing secured to the top and bottom surfaces, respectively, of a load board. The upper housing having a cavity for receipt of the integrated circuit package and including a hole in the base of the upper housing to allow a plurality of solid socket plungers to contact test sites on the integrated circuit package. The socket plungers are positioned within a plurality of channels formed in the lower housing and extend through a plurality of holes in the load board to contact the test sites. A plurality of springs are positioned in the channels of the lower housing below the socket plungers to provide a spring force to bias the socket plungers upwardly toward the integrated circuit package. A ball is positioned between the spring and a beveled edge of the plunger to aid in biasing the plunger. Electrically conductive cylindrical eyelets or plated through holes are positioned within the holes in the load board to guide the travel of the socket plungers and to transfer the test signals from the socket plungers to the load board.