The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2000

Filed:

Jul. 09, 1998
Applicant:
Inventors:

Gary M Colello, Lunenburg, MA (US);

Dennis E Hartzell, Hudson, MA (US);

Assignee:

Satcon Technology Corporation, Cambridge, MA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257698 ; 257687 ; 257699 ; 257708 ; 257723 ; 257731 ;
Abstract

A method for providing pre-placed, pre-brazed feed throughs in the substrate of a hermetic package corresponding to the terminal leads of the encased circuit COTS components. The substrate may include directly bonded copper (DBC) regions forming circular shapes where the holes for the special connectors of the present invention will be located. These holes will correspond to the leads of the COTS component that will be mounted to it. Holes are laser or mechanically drilled into the substrate inside the circular shapes formed in the DBC. To form the feed through, a bushing, such as a blind copper rivet, is brazed in the hole, with the open end thereof oriented toward the component-side of the substrate. These open ends can accept the leads of the COTS component, like the holes of a conventional PC circuit board.


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