The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2000
Filed:
Jul. 10, 1998
Shinji Isokawa, Kyoto, JP;
Hidekazu Toda, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
Obtained is a semiconductor light emitting device in which a light emitting device chip is bonded on a first lead and a second lead is electrically connected to one electrode of the light emitting device chip. Besides, the light emitting device chip and the top end of the second lead are enclosed by resin which a light from the light emitting device chip transmits. The first and second leads are respectively enclosed by heat resistant enclosing material along predetermined lengths of both leads at the bottom of the package, which is opposed to the light emitting surface. As a result, adhesiveness between the resin package and the leads is improved and thereby prevented is corrosion of the leads and the light emitting device chip in the package from occurring, which can make reliability improved.