The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2000
Filed:
Jul. 29, 1998
Kazuo Nomura, Toyama-ken, JP;
Ichiro Ishiyama, Toyama-ken, JP;
Koji Higashi, Toyama-ken, JP;
Masaki Kato, Toyama-ken, JP;
Ichiro Nagare, Toyama-ken, JP;
Hiroyuki Kurokawa, Toyama-ken, JP;
Yozo Ohara, Toyama-ken, JP;
Hokuriku Electric Industry Co., Ltd., Toyama Pref., JP;
Abstract
A multi-layer circuit board capable of reducing an electrical resistance between circuit patterns positioned inside the circuit board and a through-hole connection conductor. A plurality of circuit patterns are superposed on each other with a plurality of insulating layers being alternately interposed therebetween in turn. A solution in which ultrafine metal particles of the independent dispersion type such as silver, gold, palladium or the like are contained in a colloid-like manner is applied so as to extend from one of lands through an inner surface of a through-hole to the other land. Then, the solution is calcined to form a metal particle film, The metal particle film is coated thereon with a conductive paste such as a resin/silver paste or the like, which is then calcined to form a conductive paste layer.