The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2000
Filed:
Jun. 22, 1998
Applicant:
Inventors:
Tien-Yu Tom Lee, Phoenix, AZ (US);
James Vernon Hause, Maricopa, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257778 ; 257706 ; 257707 ;
Abstract
A semiconductor device (30) includes a semiconductor chip (11) flip chip mounted on a substrate (21) and a thermally conductive chip mount (31) mounded on the semiconductor chip (11). The thermally conductive chip mount (31) has a cavity (34) formed therein. The semiconductor chip (11) fits in the cavity (34) and is thermally coupled to the thermally conductive chip mount (31). The thermally conductive chip mount (31) provides a thermal conduction path to dissipate heat generated in the semiconductor chip (11) through its sidewalls (15, 16, 17, 18).