The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2000
Filed:
Aug. 11, 1995
Sun Microsystems, Inc., Mountain View, CA (US);
Abstract
A thermal conducting material for providing lateral thermal conduction across a surface of an integrated circuit and for enhancing thermal dissipation from the integrated circuit. The integrated circuit is incorporated within a semiconductor device having a cavity package. A layer of the thermal conducting material, preferably electrically non-conductive, is disposed on a surface of an integrated circuit in the form of a die to provide lateral heat conduction to reduce the number of hot spots within the integrated circuit. Alternatively, the thermal conducting, electrically non-conductive material may be used to fill a cavity within the cavity package so that the cavity package dissipates heat in a more effective manner.