The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2000
Filed:
May. 12, 1999
Bernd Stenger, Hammersbach, DE;
Marek Gorywoda, Hanau, DE;
David Francis Lupton, Gelnhausen, DE;
Wolfram Graf, Essen, DE;
Wolfgang Jablonski, Mettmann, DE;
W.C. Heraeus GmbH & Co. KG, Hanau, DE;
Abstract
A process for making an indium-tin-oxide shaped body, comprising: (a) filling an indium-tin-oxide powder into a first flexible mold, the indium-tin-oxide powder having a specific BET surface of at most 3 m.sup.2 /g with a mean primary particle size of 0.03 .mu.m to 1.0 .mu.m and/or having a density of at least 40% of theoretical density after cold pressing at a pressure of 100 MPa and/or the indium-tin-oxide powder being made by reacting at least two reaction partners comprising a molten indium-tin-metal alloy as a first reaction partner and oxygen as a second reaction partner in a plasma arc in a plasma chamber provided with an inlet opening for the reaction partners and an outlet with a gas-supply device to obtain a material, and quenching the material at the outlet opening of the plasma chamber with a gas stream which cools the material at a cooling rate of 10.sup.5 K/s to 10.sup.8 K/s to +50.degree. C. to +400.degree. C.; (b) cold pressing the indium-tin-oxide powder at a minimum pressure of 100 MPa; (c) placing the cold compact released from the first mold in a ceramic powder in a second mold, the ceramic powder having a maximum particle diameter of 250 .mu.m, and a melting point and a sintering temperature higher than +800.degree. C., the melting point of the second mold being higher than 800.degree. C. and the second mold being ductile under the conditions of a hot isostatic pressing; (d) sealing the second mold in a gastight manner; and (e) subjecting the wetted cold compact to hot isostatic pressing at a minimum temperature of +800.degree. C. and a minimum pressure of 20 MPa.