The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2000
Filed:
May. 14, 1999
Andy Turudic, Hillsboro, OR (US);
TriQuint Semiconductor, Inc., Hillsboro, OR (US);
Abstract
A method is disclosed for attaching a device package to a circuit board with a chip mount area that has a set of elongated pads located near the perimeter of a chip mount area. In accordance with this method, a mask is formed on the circuit board. A plurality of openings are formed in the mask, including a plurality of openings over at least one of the pads. A plurality of adhesive masses area attached to a surface of the device package, each adhesive mass being aligned with an electrical contact area on the surface of the device package. The device package is positioned over the circuit board to align the adhesive masses with the openings in the mask, and the device package is attached to the circuit board. In one embodiment, the mask openings are formed in a staggered formation. An advantage of this method is that a less expensive chip of the ball grid array type may be used on a circuit board design for gull-wing-leaded chip packages without a substantial redesign of the circuit board. The invention also allows ball grid array-type packages and gull-wing leaded chip packages to be used interchangeably for the same circuit board design with only a modification of the mask used in the circuit board fabrication process.