The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2000

Filed:

Aug. 05, 1998
Applicant:
Inventors:

Kei Tanaka, Tokyo, JP;

Eiichi Fukiharu, Tokyo, JP;

Yasunori Tanaka, Tokyo, JP;

Michinobu Tanioka, Tokyo, JP;

Kenichi Otake, Tokyo, JP;

Takuo Funaya, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
3103 / ; 310344 ; 310342 ;
Abstract

A structure for mounting a SAW (Surface Acoustic Wave) device includes photosensitive resin filling a gap between the SAW device and a mounting substrate in the peripheral portion of the SAW device. The entire structure is substantially as small in size as the SAW device and light weight. The photosensitive resin is formed in a region including pads for connection in order to absorb thermal stresses and extraneous forces apt to act on the pads. Second resin may surround the photosensitive resin or may be provided in a laminate structure together with the photosensitive resin so as to enhance a sealing ability. A method of mounting a SAW device is also disclosed.


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