The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2000
Filed:
Mar. 26, 1998
Wan-Sub Lee, Suwon, KR;
SamSung Electronics Co., Ltd., Suwon, KR;
Abstract
A heat sink assembly adapted to mount on a printed circuit board for dissipating heat from a heat generating component of an electronic device. The heat sink assembly includes a base extended upwardly from the printed circuit board, and having a heat conducting surface for conducting heat, and a heat radiating surface opposite of said heat conducting surface for radiating heat from the heat conducting surface; at least one heat generating component positioned in contact with the heat conducting surface of the base; a fastening clip for clamping the heat generating component in contact with the heat conducting surface of the base; a plurality of cooling fins extended from the heat radiating surface of the base at predetermined intervals for dissipating the heat conducted through the heat conducting surface of the base and generated from the heat generating component; and support members extended at opposite ends of the base for protecting the heat generating component and supporting the mounting of said heat sink assembly on the printed circuit board.