The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2000

Filed:

Nov. 06, 1997
Applicant:
Inventors:

Curtis L Progl, Montgomery, TX (US);

Allen P Zhang, Houston, TX (US);

Assignee:

Compaq Computer Corporation, Houston, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F / ; H05K / ;
U.S. Cl.
CPC ...
361687 ; 16226 ;
Abstract

Operational heat generated by an electronic component in the base housing of a notebook computer is transferred to the back wall of its display housing for dissipation to ambient by a heat pipe disposed in the base housing and having an evaporator portion in thermal contact with the heat-generating component, and a spreader plate structure formed from multiple thin metal layers. The spreader plate structure has a heat dissipation portion disposed within the display housing and held in thermal contact with its back wall, a pickup region disposed in the base housing and held in thermal contact with a condensing portion of the heat pipe, and a bendable dynamic portion positioned between the heat dissipation and pickup portions and extending through the lid hinge area of the computer. Each metal sheet in the dynamic region has a thin layer of a plastic material secured to its opposite sides and serving to reinforce the sheet and prevent abrasive rubbing between facing metal sheets during bending thereof as the display housing is pivotally opened and closed. Operating heat from the component is transferred to the lid housing back wall sequentially through the heat pipe and the pickup, dynamic and spreader portions of the plate structure.


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