The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2000
Filed:
Apr. 30, 1998
Ritsu Katsuoka, Kobe, JP;
Naoyasu Udono, Kobe, JP;
Takashi Shibuya, Yokosuka, JP;
Koichi Sekiguchi, Asaka, JP;
Kenji Matsui, Kitamoto, JP;
Fujitsu Ten Limited, Kobe, JP;
Abstract
By addition of a polyamide resin, which is compatible with rosin-based resins as the main components of liquid flux and solder paste flux, which is resistant to temperature variation and provides a damp proofing effect, and particularly a polyamide resin which is obtained by polycondensation reaction of a dicarboxylic acid of 2 to 21 carbon atoms and a diamine and has a softening point of 80.degree. to 150.degree. C., or a polyamide resin which is obtained by polycondensation reaction of a dimer acid and a diamine and has a softening point of 80.degree. to 150.degree. C., highly reliable low-viscosity liquid fluxes and solder paste fluxes, with which solderability is not impaired, where the flux residues on printed circuit boards after soldering undergoes no cracking or deterioration even under temperature variation, and which prevent poor insulation and migration even under high humidity environment, are provided.