The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2000

Filed:

Aug. 21, 1998
Applicant:
Inventors:

Yoshiaki Tachibana, Hitachinaka, JP;

Masanobu Deguchi, Hitachinaka, JP;

Kunihiro Tamahashi, Hitachinaka, JP;

Jun Nagata, Hitachinaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D / ;
U.S. Cl.
CPC ...
156245 ; 156290 ; 156292 ; 156310 ; 156314 ; 156330 ; 298901 ;
Abstract

The same material as the molded members is dissolved in solvent. The solvent is evaporated to form an adhesive layer. The molded members are adhered together via the adhesive layer. The molded members and the adhesive layer are heated and fused together to produce an ink jet head having a monocoque structure formed from a single material including the adhesive layer.


Find Patent Forward Citations

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Tachibana, Yoshiaki. (2000). Method for adhering together members molded from synthetic resin (U.S. Patent No. 6074510). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6074510

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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