The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2000

Filed:

Jul. 15, 1998
Applicant:
Inventor:

Asdrubal Garcia-Ortiz, St. Louis County, MO (US);

Assignee:

Systems & Electronics, Inc., St. Louis, MO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361704 ; 165 46 ; 174 163 ; 361689 ;
Abstract

Heat sink apparatus (100) for use in an enclosure (12) in which electrical component; installed on circuits boards (42, 44, 48, 50) are mounted in the enclosure in a stacked arrangement (30) with the components in proximity to each other. Heat conductive plates (102) are also formed in a stacked arrangement and are inserted between adjacent circuit boards in an interdigitated manner for heat generated by the components to be conducted away from the components by the plates. A plurality of pouches (106, 116) containing a liquid heat sink material or surface comformable, conductive elastomer pads are inserted between each side of each heat conductive plates and the printed circuit boards, and between sidewalls (51, 52, 18) of the enclosure and the stack of heat conductive plates. The heat sink apparatus (100) increases the efficiency of heat transfer away from the components so to prevent the components from overheating by providing a heat conduction, transfer path from the components (118) to the enclosure (12).


Find Patent Forward Citations

Loading…