Polybutadiene and polyisoprene thermosetting compositions and method of

Abstract

An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene in an amount of about 15 to about 50 volume %; a fabric reinforcement in an amount of 0 to about 40 volume %; a particulate filler, preferably ceramic, in an amount of from 0 to about 60 volume %; microballoons in an amount from 0 to about 60 volume %; and optionally a flame retardant. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. The composition of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated onto one or both opposed surfaces to a metal conductive foil such as copper.