The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2000
Filed:
Oct. 24, 1997
Hiromichi Kobayashi, Yokkaichi, JP;
NGK Insulators, Ltd., , JP;
Abstract
A process for producing a bonded article of ceramic bodies comprising steps of: machining the ceramic bodies to be bonded to form machined surfaces with average surface roughnesses (Ra) of not more than 0.2 .mu.m and flatnesses of not more than 0.2 .mu.m; applying solution containing a bonding aid on at least one of the machined surfaces; contacting the machined surfaces with each other to produce an assembly; and subjecting the assembly to a heat treatment to produce the bonded article. The roughnesses and the flatnesses may preferably be not more than 0.1 .mu.m. The bonding aid may preferably be a sintering aid applicable to at least one of the ceramic bodies. The ceramic bodies may preferably be one or more material selected from a group consisting of aluminum nitride and silicon nitride. The bonding aid may preferably be one or more bonding aid selected from a group consisting of a substance of yttrium and a substance of ytterbium. In the article, a layer rich in elements contained in a bonding aid is formed along the bonding interface of the article and ceramic particles are grown across the bonding interface.