The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2000
Filed:
Sep. 25, 1997
Applicant:
Inventor:
Frank Prein, Glen Allen, VA (US);
Assignee:
Siemens Aktiengesellschaft, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F / ; G06F / ; G06K / ;
U.S. Cl.
CPC ...
39550011 ; 700110 ; 700121 ; 702 84 ; 702181 ; 382149 ;
Abstract
A method of fabricating semiconductor chips includes the steps of optimizing a number of chips that geometrically fit on a wafer and maximizing chip yield for the wafer by considering chips located in a normally rejectable location and utilizing yield probability data for the chip in the normally rejectable locations to weight the probability of an acceptable chip such that if the probability is above a threshold value the chips are not rejected. This results in an increased chip yield for semiconductor wafers.