The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2000
Filed:
Feb. 25, 1999
Applicant:
Inventors:
Tomoya Tsunoda, Hitachi, JP;
Keiichi Morikawa, Komae, JP;
Mitsuru Onoda, Takahagi, JP;
Shigeo Amagi, Naka-gun, JP;
Tatsuo Honda, Hitachinaka, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K / ;
U.S. Cl.
CPC ...
310180 ; 1741 / ; 1741 / ; 29596 ; 156 56 ;
Abstract
The high thermoconductive insulating film 11 was formed around the outer periphery of the wound conductors 10, using the high thermoconductive insulating tape 1 comprising the mica layer 3, the reinforcement layer 5, and the high thermoconductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high thermoconductive filler layer 7 is specified to the range of 10-25% by weight of the total weight of the material.