The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2000
Filed:
Nov. 12, 1996
Applicant:
Inventors:
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438693 ; 438970 ; 216 38 ; 216 89 ;
Abstract
Chemical mechanical polisher is disclosed. A polishing slurry stored in a polishing slurry tank, used in this polishing contains a solvent and polishing particles dispersed in the solvent. The polishing particles are selected from silicon nitride, silicon carbide, and graphite. The material to be polished is polished by using a polishing slurry containing silicon nitride particles until a silicon nitride etch stop layer is reached.
Miyashita, Naoto. (2000). Polishing method, semiconductor device fabrication method, and (U.S. Patent No. 6069083). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6069083
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