The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2000
Filed:
Nov. 15, 1995
Jin Sung Kim, Chungeheongbuk-do, KR;
LG Semicon Co., Ltd., Chungcheongbuk, KR;
Abstract
Semiconductor packaged and methods for packaging semiconductor devices are provided. A method in accordance with the invention may include the steps of: attaching solder bumps on bonding pads of a wafer; cutting the wafer into individual chips, and attaching the chips to an interface board; coupling the interface board with a lead frame; and wire-bonding the bump pads of the interface board and the inner leads of the lead frame, and carrying out a molding process. The semiconductor package may include an interface board having an interface board substrate, a plurality of interface board bump pads, wires for connecting the interface board bump pads on upper and lower faces of the substrate, and wire bonding pads electrically connected to the interface board bump pads; an upper chip and a lower chip attached on the upper and lower portions of the interface board, and electrically connected through the solder bumps to the bonding pads of the chip; inner leads and outer leads connected through wires to the wire bonding pads of the interface board; and a molding compound.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile