The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2000
Filed:
Apr. 15, 1999
Applicant:
Inventor:
Tomoo Murakami, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438108 ; 438127 ; 438469 ; 257778 ;
Abstract
The object of this invention is to provide a method whereby, during flip-chip connection using a thermosetting resin, it is possible to prevent the development of voids in the resin when the resin is hardened by pulse heating. The object is fulfilled by providing a method comprising heating a chip 4 to thereby harden a thermosetting resin 3 while applying a pressure to the chip 4 towards a substrate 1 to put a bump electrode 6 into contact with a wiring 2, wherein heating temperatures are adjusted appropriately according to: