The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2000

Filed:

Nov. 01, 1996
Applicant:
Inventors:

Atsushi Takeuchi, Wako, JP;

Minoru Makuta, Wako, JP;

Hitoshi Ohgane, Wako, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C / ; B60R / ;
U.S. Cl.
CPC ...
264255 ; 2643288 ; 425130 ; 293120 ;
Abstract

A process for producing a bumper for a vehicle uses a first step of injecting an outer layer forming material into a bumper forming cavity through a gate in a mold, and a second step of injecting a core forming material, thereby allowing the core forming material to flow into the outer layer forming material existing in said gate and said cavity, while allowing the outer layer and core forming materials to flow within the cavity. In the mold, the volume of a mounting portion forming area of the bumper forming cavity is set so that the thickness t.sub.1 of at least a mounting portion of the bumper for mounting to a vehicle body to extend laterally from a central portion of the vehicle body can be larger than the thickness t.sub.2 of a bumper main portion excluding the mounting portion, and the gate opens into the mounting portion forming area. Thus, the outer layer forming material can be allowed to flow substantially uniformly over the entire cavity, thereby enhancing the filling rate of the core forming material.


Find Patent Forward Citations

Loading…