Pad tape surface polishing method and apparatus

Abstract

A surface polishing method comprises allowing a holder to hold a flat sheet-like workpiece, placing a pad tape in a location opposite to the holder, the pad tape consisting of a tape substrate and grains bonded to the substrate surface, supplying free grains between the holder and the pad tape, and rotating the holder and/or a mechanism holding the tape, thereby causing the free grains to polish the workpiece. An apparatus for practicing the method comprises a holder capable of holding a flat sheet-like workpiece, a tape holding mechanism located opposite to the surface of the workpiece and carrying a pad tape which consists of a tape substrate and grains bonded to the substrate, a rotary mechanism for rotating the holder and/or the tape holding mechanism, and an abrasive supplying mechanism for supplying free grains between the surface of the workpiece and the pad tape. The apparatus may further comprise a tape conveying mechanism for feeding the pad tape intermittently and/or a rocking mechanism for rocking the holder or the tape holding mechanism. The rotary mechanism maybe designed to cause eccentric motion or planetary motion of the holder.