The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2000
Filed:
Dec. 16, 1997
Howard R Test, Plano, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A system (270, 370) for connecting a semiconductor chip (22, 322) to a leadframe (12), the system (270, 370) includes a three-dimensional leadframe (12) and a bonding support mechanism (202, 302, 402). The leadframe (12) may include a first lead (32, 132, 332, 432) having a first base portion (144), a first lead tip (42, 142, 342, 442), and a first longitudinal axis (305); a second lead (30, 130, 330, 430) having a second base portion (140, 321), a second lead tip (36, 136, 336, 436), and a second longitudinal axis. The first lead (32, 132, 332, 432) and second lead (30, 130, 330, 430) formed substantially adjacent to each other, and the second lead (30, 130, 330, 430) having a stepped portion (38, 138, 338, 438) such that the lead tips (42, 142, 342, 442, 36, 136, 336, 436) of the first lead (132, 332, 432) and second lead (130, 330, 430) are separated in a Z-direction (52) and in a Y-direction (52). The bonding support mechanism (202, 302) for holding the three-dimensional leadframe (12) may include a support body (215, 315), a trough (203, 303) formed on the support body (215, 315). The trough (203, 303) may have a first surface (204, 304) at a first elevation, where the first surface (204, 304) is for supporting the second lead tip (36, 136, 336). A second surface (206, 306) may be formed on the support body (215, 315) at a second elevation and substantially adjacent to the first surface (204, 304). The second surface (206, 306) is for supporting the first lead tip (42, 142, 342). The first elevation and second elevation may be displaced from each other. The bonding support mechanism (202, 302) may have an angled surface (210, 310) for accommodating a stepped portion (38, 138, 338, 438) of the second lead (30, 130, 330) and may have additional support surfaces (376, 319).