The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2000
Filed:
Jul. 10, 1998
William H Hill, Pala, CA (US);
John B Gabaldon, San Diego, CA (US);
Todd G Wieseler, Carlsbad, CA (US);
Palomar Technologies, Inc., Vista, CA (US);
Abstract
A wire conveyance system is provided for a wire bonding machine having, in series, a first wire handler, a wire slacking device and a second wire handler. The wire slacking device includes a wire support chamber having a substantially enclosed bottom, opposing first and second vertical sidewalls, a substantially open top, a back opening and a front opening. The wire slacking device further includes a pressurized fluid source and first and second fluid orifices for receiving a pressurized fluid from the pressurized fluid source. The fluid orifices extend through the first or second sidewall of the wire support chamber with the second fluid orifice being positioned downstream of the first fluid orifice. First and second fluid paths are provided in fluid communication with the pressurized fluid source via the first and second fluid orifices. The first and second fluid paths extend upward between the first and second sidewalls of the wire support chamber and out the open top. A wire support path extends laterally through the wire support chamber above the first and second fluid orifices. The wire support path is substantially contactless with respect to the wire slacking device.