The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2000

Filed:

Aug. 19, 1997
Applicant:
Inventors:

Atsushi Higashiura, Tokyo, JP;

Isamu Kobayashi, Tokyo, JP;

Naoyuki Chida, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B / ;
U.S. Cl.
CPC ...
1741 / ; 1741 / ; 1741 / ;
Abstract

There is disclosed an insulated wire having an extrusion-coating insulating layer provided on the outer surface of a conductor directly or via some other layer, or provided on the peripheral surface of a multicore wire composed of conductor cores or insulated cores that are collected together, wherein the extrusion-coating insulating layer is made of a resin mixture to be extrusion-coated, which comprises 100 parts by weight of a resin (A) comprising a polyethersulfone resin, as an essential component, and, optionally, a polyetherimide resin, and 10 to 100 parts by weight of a resin (B) comprising at least one resin selected from polycarbonate resins, polyarylate resins, polyester resins, and polyamide resins. According to the insulated wire whose insulating layer is formed by the extrusion coating method, its direct solderability is excellent, and at least its heat resistance is better than that of conventional polyester-series resins, and by some blending proportions of the resin mixture, the insulated wire results in heat resistance that easily satisfies at least Heat Resistance Class B stipulated by IEC standard Pub. 172.


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