The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2000

Filed:

Oct. 28, 1997
Applicant:
Inventors:

Youn Tae Kim, Daejon-Shi, KR;

Chi Hoon Jun, Daejon-Shi, KR;

Jong Tae Baek, Daejon-Shi, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438627 ; 438628 ; 438630 ; 438642 ; 438643 ; 438644 ; 438648 ; 438649 ; 438652 ; 438653 ; 438654 ; 438655 ; 438656 ; 438658 ; 438660 ; 438664 ; 438685 ;
Abstract

A three elemental compound for diffusion barrier layer having a superior diffusion barrier characteristics manufactured by forming the compound between the silicon diffused into the diffusion barrier layer and the two elemental compound for diffusion barrier layer before the metal wire layer penetrates into the diffusion barrier layer to reach the underlying silicon layer, using the different characteristics of the diffusion rate as above, is disclosed. A method of forming three elemental compound for diffusion barrier layer according to the present invention comprises a silicon substrate. A silicide layer is deposited on the silicon substrate. A refractory metal nitride layer is then deposited on the silicide layer. A metal wire layer is deposited on the refractory metal nitride layer. A heat treatment of the resulting structure is performed to form a three elemental compound for diffusion barrier layer between the silicide layer and the refractory metal nitride layer by out-diffusing a silicon contained in the silicide layer and reacting the silicon introduced into the refractory metal nitride layer with the refractory metal nitride layer, such that the diffusion barrier characteristics is improved.


Find Patent Forward Citations

Loading…