The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2000
Filed:
Sep. 22, 1999
Hideo Seki, Saitama, JP;
Honda Giken Kabushiki Kaisha, Tokyo, JP;
Abstract
A plurality of semiconductor circuits provided on a semiconductor wafer are arranged in a plurality of rows. The plurality of semiconductor circuits of each row are connected in series through first and second conductive layers provided between adjacent two of the semiconductor circuits of each row. The plurality of semiconductor circuits are connected to power supply terminals provided on the semiconductor wafer. The first and second conductive layers may be provided separately from the higher and lower voltage side power supply lines, or one of the first and second conductive layers may be common to one of the higher and lower voltage side power supply lines. The power supply is connected to the power supply terminals and the plurality of semiconductor circuits is aged. After the aging, the power supply is disconnected from the power supply terminals. In this state, electrical characteristics of each semiconductor circuit is measured in a state in which the semiconductor circuits is isolated from the other semiconductor circuits.