The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2000

Filed:

Nov. 19, 1992
Applicant:
Inventors:

Yukihiko Terasawa, Fussa, JP;

Makoto Hamano, Okutama-machi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
156345 ;
Abstract

A semiconductor wafer has a pair of opposed major faces separated by a peripheral edge face. The peripheral edge face of the wafer is etched by one or more etching rollers which are brought into pressure contact with the wafer edge face under suitable contact pressure. The etching rollers and the wafer are rotated while in pressure contact, and an etching liquid is supplied to the rollers and transferred to the wafer during the rotation to effect etching of the edge face of the wafer. A washing roller applies a washing liquid, such as pure water, onto the wafer edge face to wash the same. Harmful gas vapors evolved during etching are prevented from contacting the wafer surfaces by blowing a pressurized gas, such as nitrogen gas, along the wafer surfaces toward the wafer periphery.


Find Patent Forward Citations

Terasawa, Yukihiko. (2000). Method and apparatus for etching an edge face of a wafer (U.S. Patent No. 6063232). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6063232

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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