The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2000
Filed:
Mar. 11, 1998
Benny R Rich, Oakwood, GA (US);
Frank J Tortorici, Oakwood, GA (US);
James T Pittman, Lula, GA (US);
Dittler Brothers Incorporated, Atlanta, GA (US);
Abstract
A direct response mailing includes a response card and a set of stamps. The response card has a pressure sensitive adhesive patterned and applied to certain fields of the response card and has removable members placed on top of the pressure sensitive adhesive. The sheet of stamps is perforated into the individual stamps and are entirely unsupported with no adhesive applied to them. To formulate a response, a resident removes a desired set of stamps from the sheet and also detaches the removable members from the response card. The resident then places each stamp into a preferred one of the fields on the response card. Although the stamps have no adhesive, the pressure sensitive adhesive on the response card secures the stamps to the card. The direct response mailing does not have a remoistenable gummed sheet of stamps and thus benefits from not requiring the resident to lick the stamps and also has the benefit of being less prone to water damage during delivery in the mail. The direct response mailing also reduces waste and cost in comparison to a set of stamps fully coated with a pressure sensitive adhesive.