The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2000

Filed:

Jun. 04, 1996
Applicant:
Inventor:

Seung Moo Lee, Kyoungki-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
438622 ; 438636 ; 438643 ; 438653 ;
Abstract

A method for forming metal wirings, which includes the steps of forming over an insulating film a conduction pattern corresponding to metal wirings, which will be subsequently formed, plasma-treating the surface of the resulting structure, forming an oxide film, which contains Si atoms with a refraction index of 1.47 or above in an excessive amount, using SiH.sub.4 --N.sub.2 O mixed gas, and forming an O.sub.3 -TEOS film over the oxide film. In accordance with this method, it is possible to prevent a formation of voids in the insulating layer and a degradation in the quality of the insulating layer while achieving a superior reproducibility, an improved yield and an improved reliability.


Find Patent Forward Citations

Lee, Seung. (2000). Method for forming insulating film between metal wirings of (U.S. Patent No. 6060382). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6060382

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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