The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2000
Filed:
Nov. 28, 1997
Masahiko Hamada, Amagasaki, JP;
Yasuto Fukada, Hachioji, JP;
Masakatsu Ueda, Tawaramotocho, JP;
Yuuichi Komizo, Nishinomiya, JP;
Sumitomo Metal Industries, Ltd., Osaka, JP;
Abstract
The present invention provides (1) diffusion bonding methods for joining metallic materials like carbon steels or stainless steels,interposing a bonding material, such as 10 to 80 .mu.m thick Ni-based alloy with the melting point of 1150.degree. C. or lower,between base materials, heating so that the length heated at 800.degree. C. or above measures from 3 to 20 mm, in case of joining stainless steels a bonded layer, further, being heated between the both melting points, and applying the compressive stress, for example 0.5 to 2 kgf/mm.sup.2, so that a lateral expansion ratio is made within 1.0 to 1.1, and (2) a joined structure having the bonded joint formed thereby.