The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2000

Filed:

Sep. 18, 1998
Applicant:
Inventors:

Padman Parayanthal, Clinton Township, NJ (US);

Gleb E Shtengel, Upper Milford Township, PA (US);

Assignee:

Lucent Technologies Inc., Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F / ; G02B / ; G02B / ; H01S / ;
U.S. Cl.
CPC ...
359248 ; 359237 ; 359238 ; 385 14 ; 372 38 ;
Abstract

An optoelectronic device, such as an electro-absorption modulator laser (EML), is configured to a submount using an asymmetric inductive peaking scheme in which a first wire connects a modulator signal electrode on the submount to the modulator contact pad on the device and a second wire connects the modulator contact pad to an integrated resistor on the submount, where the first and second wires have substantially different inductances. Such asymmetric inductive peaking improves the high-frequency performance of the resulting packaged device by providing a higher transmission coefficient and a lower return loss at high frequencies than devices configured using conventional symmetric inductive peaking in which the inductances of the two connecting wires are purposely designed to be equal. In one embodiment, in which the device will be modulated by a standard 50-ohm electrical signal generator, the integrated resistor is a 50-ohm device, the first wire is kept as short as practicable (e.g., about 0.3 mm) and the second wire is made as long as practicable (e.g., about 1.5 mm). The resulting packaged devices show good high-frequency performance for a wide range of device parameters.


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