The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2000
Filed:
Jan. 27, 1998
Robert Earl Terrill, Carrollton, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method of fabricating bond pads on a semiconductor device which includes providing a semiconductor device having a surface. A coating of solderable electrically conductive metal is deposited on the surface, preferably by sputtering, and portions of the coating are selectively removed by ablation or vaporization, preferably by use of a laser beam. The selective removal is accomplished by selective movement of the laser relative to the coating or by use of a mask followed by traversal of the laser beam over the entire coating. The coating is preferably a 500 angstrom layer of chromium over which is a 1500 angstrom layer of palladium followed by a 3500 angstrom layer of gold.