Plastic-encapsulated semiconductor device equipped with loc package

Abstract

A plastic-encapsulated semiconductor device is provided, which makes it possible to reinforce the power/ground line by a bus-bar without using the over-lead bonding technique. This device is comprised of (a) an IC chip having a surface on which a first plurality of bonding pads and a second plurality of bonding pads are provided, the first plurality of pads being arranged in a central area of the surface and the second plurality of pads being arranged in a peripheral area of the surface; (b) lead fingers whose inner ends are fixed to the surface of the chip, at least one of the fingers serving as a part of a power/ground line for the chip; (c) a bus-bar mechanically and electrically connected to the at least one of the fingers serving as a part of the power/ground line, the bus-bar extending over the surface of the chip and; (d) bonding wires for electrically connecting the inner ends of the fingers and the bus-bar to corresponding ones of the first and second pluralities of bonding pads; and (e) a plastic package for encapsulating the chip, inner portions of the fingers, the bus-bar, and the wires, while protruding outer portions of the fingers. The bus-bar extends over the central area of the surface of the chip so that the wires electrically connecting the first plurality of pads to corresponding ones of the lead fingers do not overlap with the bus-bar.