The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2000
Filed:
May. 14, 1999
Applicant:
Inventors:
Takeshi Ito, Fukushima, JP;
Hideaki Sakuma, Fukushima, JP;
Assignee:
Tohoku Munekata Co., Ltd., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
219245 ; 1563797 ; 1562739 ;
Abstract
A molded product is thermally bonded mutually with another molded product by disposing the resistance heating element (20) to the bonding face of product molded with the thermoplastic resin, making the bonding electrode (10) contact the resistance heating element (20) and by impressing the voltage for its heat generation. The heat generation temperature of the resistance heating element (20) at the voltage impressed portion (21) is suppressed to the level lower than the fusion temperature of resin by blowing the cooling gas toward the voltage impressed portion (21) from a vent hole (11) provided on the bonding electrode (10).