The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2000
Filed:
Aug. 28, 1998
Tsuyoshi Kurokawa, Fujisawa, JP;
Fusaki Koshiishi, Fujisawa, JP;
Hiroyuki Shimizu, Fujisawa, JP;
Takaaki Ito, Fujisawa, JP;
Kazuhiko Ito, Fujisawa, JP;
Kabushiki Kaisha Kobe Seiko Sho, Kobe, JP;
Abstract
Described is a solid wire for MAG welding which has no copper plating on the wire surface and which has good welding workabilities such as a reduced amount of generated spatters and good arc stability in the MAG welding of steel sheets. A solid wire for MAG welding comprises, as chemical components for the wire, 0.01 to 0.15 wt % of C, 0.20 to 1.00 wt % of Si, 0.70 to 1.70 wt % of Mn, 0.30 wt % or below of Ti, 0.025 wt % or below of S, 0.020 wt % or below of O, and the balance being Fe and inevitable impurities, wherein said wire is applied on the surface thereof with at least one compound serving as an arc stabilizer and selected from the group consisting of a K compound and a Cs compound in such a way that when an amount of the K compound to be applied to (calculated as K) is taken as Appm relative to the weight of said wire and an amount of the Cs compound (calculated as Cs) is taken as Bppm, a value of (A+3B) is in the range of 2 to 15 ppm. The wire has such a structure as not to be plated with copper on the surface thereof.