The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2000

Filed:

Mar. 09, 1998
Applicant:
Inventors:

Han-Sheng Lee, Bloomfield Hills, MI (US);

Chi Hung Leung, Rochester Hills, MI (US);

Qian Shi, Novi, MI (US);

Shih-Chia Chang, Bloomfield Hills, MI (US);

David Byrum Hicks, Farmington Hills, MI (US);

Samuel Lorincz, Boardman, OH (US);

Iulian Nedelescu, Cortland, OH (US);

Assignee:

General Motors Corporation, Detroit, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H / ;
U.S. Cl.
CPC ...
200181 ;
Abstract

Structures and fabrication methods of micromachined all-metal relays on silicon chips are described. The relay comprises a copper blade, electroformed into the lithographically patterned areas, with suitable dimensions of 1 mm.times.2 mm.times.0.01 mm (width.times.length.times.thickness) and a plurality of longitudinal slots to facilitate fabrication of the blade. The relay is actuated by electrostatic force, and no conduction current is required to hold the relay at either 'on' or 'off' state. Preferably, the relay is used in combination with a suitable arc suppression circuit.


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