The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2000
Filed:
Oct. 10, 1997
Applicant:
Inventors:
Kiyokazu Moriizumi, Kawasaki, JP;
Shunichi Kikuchi, Kawasaki, JP;
Kazuhiro Nitta, Kawasaki, JP;
Naomi Fukunaga, Kawasaki, JP;
Mitsuo Suehiro, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R / ; H01R / ;
U.S. Cl.
CPC ...
174261 ; 174267 ; 174260 ; 361773 ; 361774 ;
Abstract
The thin-film multi-layer substrate includes an insulating substrate base plate, and a thin-film structure including a plurality of conducting layers and a plurality of insulating layers formed on the substrate base plate. A via structure is formed in the thin-film structure and connected to one of the conducting layers of the thin-layer structure. Pins are connected to the via structure, such that the bottom of the via structure is directly laminated on the substrate base plate, and the pins are secured onto the via structure.