The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2000
Filed:
Feb. 14, 1997
Applicant:
Inventors:
Michael H Bunyan, Chelmsford, MA (US);
Miksa de Sorgo, Windham, NH (US);
Assignee:
Parker-Hannifin Corporation, Cleveland, OH (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K / ;
U.S. Cl.
CPC ...
428 405 ; 428 413 ; 428 418 ; 428220 ; 428348 ; 428349 ; 428515 ; 156247 ; 1563066 ; 1563244 ; 165185 ; 252 74 ; 361700 ; 361713 ; 361704 ; 257714 ; 524399 ; 524400 ; 524404 ; 524428 ; 524489 ; 525220 ; 525240 ;
Abstract
A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.