The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2000

Filed:

Oct. 21, 1998
Applicant:
Inventors:

Yoshihiko Gotoh, Shiga-ken, JP;

Masato Kobayashi, Omihachiman, JP;

Katsuhiko Tanaka, Ibaraki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P / ; H01P / ; H01P / ;
U.S. Cl.
CPC ...
333204 ; 333219 ; 333238 ;
Abstract

A thin-film multilayered electrode has a dielectric substrate; a ground conductor provided on a back surface of the dielectric substrate; and a plurality of thin-film conductive layers and dielectric layers alternately stacked on a front surface of the dielectric substrate. In one example, the ground conductor, one of the thin-film conductive layers in contact with the dielectric substrate and the dielectric substrate interposed therebetween form a TEM mode principal transmission line, and each thin-film dielectric layer and a pair of thin-film conductive layers sandwiching the thin-film dielectric layer form a TEM mode sub-transmission line. A thickness and a dielectric constant of each thin-film dielectric layer is set such that phase velocities of TEM waves which propagate through the TEM mode principal transmission line and the TEM mode sub-transmission lines are substantially identical with each other. A thickness of each thin-film conductive layer is set at a predetermined value which is smaller than a skin depth at a predetermined operating frequency such that electromagnetic fields between the TEM mode principal transmission line and its adjacent TEM mode sub-transmission line, and between each adjacent pair of TEM mode sub-transmission lines, are coupled with each other. At least one of the thin-film dielectric layers which is closest to the dielectric substrate has a thickness greater than that of the other thin-film dielectric layers.


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