The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2000

Filed:

Jun. 06, 1997
Applicant:
Inventors:

Masaaki Hayama, Nara, JP;

Noboru Mouri, Katano, JP;

Tetsu Murakawa, Neyagawa, JP;

Hayami Matsunaga, Hirakata, JP;

Masayuki Mizuno, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
438108 ; 438611 ; 438616 ; 438622 ; 438623 ; 438662 ; 438670 ; 438977 ;
Abstract

In a method of manufacturing an electronic component for forming a conductor pattern on an insulating substrate by transfer method employing intaglio printing technique, this manufacturing method comprises a step of fabricating an intaglio 20 made of flexible resin forming an insulating layer 23 on a groove 21, a step of filling the groove 21 with Ag paste 24 and drying, a step of overlaying the intaglio 20 on an insulating substrate 2 having a water-soluble resin 28 formed on the surface by pressing a pressing portion 26, freezing, peeling off the intaglio 20 and insulating substrate 2, and transferring the pattern of the Ag paste 24, and a step of firing it and forming a conductor pattern.


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