The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2000
Filed:
Apr. 23, 1998
Applicant:
Inventors:
Michael Mou, Tu-Cheng, TW;
Bill Yuan Chuang, Hsinchu, TW;
Arnold Chang Yang, Hsinchu Hsien, TW;
Jing Yuang Ho, Hsinchu Hsien, TW;
Assignee:
Microjet Technology Co., Ltd., Hsinch Hsien, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05C / ; B25B / ;
U.S. Cl.
CPC ...
118500 ; 269 21 ; 211 4118 ;
Abstract
A wafer securing device and method for securing a planar plate on a wafer having a hollowed-out portion, the device including a substrate for receiving the wafer; a groove provided on the substrate and having an opening, the hollowed-out portion corresponding to the groove when the wafer is placed on the substrate; and an air extracting equipment for extracting air from the groove when the wafer is placed on the substrate so that the planar plate placed on the wafer is secured to the wafer by means of a vacuum suction force.