The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2000
Filed:
Jun. 25, 1997
Brian D Chapman, Poughkeepsie, NY (US);
James J Petrone, Hyde Park, NY (US);
Wai Mon Ma, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of forming a solder ball structure comprising the steps of 1) obtaining a first object having at least one high melting point solder ball, each solder ball having a corresponding BLM containing a low melting point solder, each solder ball having an outer surface, top and bottom, each BLM having a top and bottom, the bottom of each solder ball in contact with the top of the corresponding BLM over a portion of the outer surface, the bottom of each BLM in electrical communication with the first object; 2) obtaining a template having a first surface; 3) applying a disjoint area of low melting point solder paste to the first surface of the template; 4) interacting the top of each solder ball and the solder paste; and 5) reflowing each solder ball and disjoint area of solder paste while each solder ball and disjoint area of solder paste are interacted.